Pouya Asrar is a senior engineering leader and thermal science expert. He is experienced in advanced semiconductor packaging, consumer electronics, and high-performance thermal management. Pouya Asrar’s career spans customer-facing technical leadership, hands-on engineering, and academic research, combining rigorous analysis with practical execution across complex, global organizations.
Pouya Asrar currently serves as a senior manager in advanced packaging at Samsung. There, he leads customer-facing technical and business engagements across multiple advanced packaging technologies. In this role, he acts as a bridge between customer requirements and internal engineering execution, guiding programs from early business alignment through design, qualification, and delivery.
Before working at Samsung, Pouya Asrar worked as a thermal engineer at Amazon, where he designed and validated thermal management solutions for smart home devices across a wide range of form factors. His responsibilities included defining thermal architectures, building detailed CFD models, and guiding design decisions under tight size, cost, and schedule constraints. He also paired simulation-driven optimization with extensive laboratory testing to support confident thermal sign-off and production readiness.