Why Chip Packaging Affects Cooling ChoicesOct 15, 2026
San Jose, CA, US

Pouya Asrar is a senior engineering leader and thermal science expert. He is experienced in advanced semiconductor packaging, consumer electronics, and high-performance thermal management. Pouya Asrar’s career spans customer-facing technical leadership, hands-on engineering, and academic research, combining rigorous analysis with practical execution across complex, global organizations.
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Why Chip Packaging Affects Cooling ChoicesOct 15, 2026
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